eeNews Europe
Belgian researcher centre imec has teamed up with ASML in Holland to evaluate the latest metrology technology for building silicon chips at 3nm and beyond.
Semiconductor manufacturing equipment maker ASML Holding NV (Veldhoven, The Netherlands) and research institute IMEC (Leuven, Belgium) have agreed to extend collaboration on EUV lithography to go beyond the 3nm logic node.
Infineon components will be easily integrated into edge-computing applications through support for Amazon Web Services (AWS).
Measuring not only the temperature but also the direction of the heat source used to require complex test setups. By combining various thermomagnetic effects, sensors for direction-dependent temperature sensors can be built, as a research team from various universities and research institutes in Germany has discovered.